October 14, 2026
The transient plane source thermal conductivity tester adopts TPS technology to realize fast and non‑destructive thermal conductivity measurement for various materials, complying with ISO 22007‑2 international standard. Widely applied in new‑material R&D, building materials, polymer and metal quality control, it completes a test within 5‑160 seconds. It supports solids, powders, colloids, liquids and other samples without complicated sample preparation, with testing accuracy of ±3%. This article analyzes the instrument from principle, value, operation and FAQs to help purchasers and researchers select equipment and avoid pain points such as long testing cycles, sample damage and contact thermal resistance interference.
The Transient Plane Source (TPS) method is a non‑steady‑state thermophysical testing technology. The BXT‑DR‑S thermal conductivity tester centers on this technology. It adopts double‑helix thin‑film probe made of etched conductive alloy with double‑layer insulating protective layers, acting both as heating source and temperature sensor. Its physical principle is built upon transient temperature response generated by disc‑shaped heat source with step heating in infinite medium. Alloy resistance changes linearly with temperature. The system converts resistance variation into temperature signal and calculates thermal conductivity and thermal diffusivity directly via dedicated mathematical models, without indirect calculation from density or specific heat input.
Its measuring range covers 0.001‑300 W/(m·K). Sample measuring temperature ranges from ‑20 ℃ to 320 ℃ (with optional external temperature‑control module). Three interchangeable probes (7.5 mm,15 mm,30 mm) are provided for low‑conductivity thin specimens, general‑purpose samples and high‑conductivity samples respectively. Equipped with ARM main controller and imported data acquisition chips, as well as color touch‑screen HMI, it automatically collects data, conducts computation and outputs test reports as a standardized absolute‑method thermophysical testing instrument.
Thermophysical property measurement has long‑standing industry pain points. Steady‑state guarded hot‑plate method takes hours for single test, hindering R&D iteration and incoming‑material inspection. Laser flash and hot‑wire methods impose strict requirements on sample dimension and machining, raising sample‑preparation cost. Contact thermal resistance causes deviation and poor repeatability. Many devices can only test solid samples, requiring multiple instruments for powders, pastes and liquids. The BXT‑DR‑S transient plane source thermal conductivity tester addresses these challenges with four core strengths.
First, it greatly improves testing efficiency with 5‑160‑second testing cycle, suitable for production‑line sampling and batch laboratory tests for polymer composites and thermal‑insulation building materials. Second, it supports diverse samples with low preparation threshold. Only relatively flat surface is required for solid blocks. It measures metals, foamed insulation materials, mineral wool, colloids and powders to cut machining costs. Third, it delivers non‑destructive measurement for sample reuse. Sample temperature rise stays below 15 ℃, so precious specimens can go through subsequent physical‑chemical analysis. Fourth, it mitigates contact thermal‑resistance interference. Offering ±3% accuracy and ≤3% repeatability error under ISO 22007‑2 standard, it generates valid data for research papers and factory inspection reports to support formula iteration, insulation‑material performance verification and high‑conductivity alloy characterization.
In real industrial and laboratory scenarios, BXT‑DR‑S follows standardized double‑sided clamping workflow. The probe is sandwiched between two identical specimens to form a “sample‑probe‑sample” sandwich structure, ensuring heat diffuses toward both sides and validating the physical model. Select probes according to sample characteristics: No.1 7.5 mm probe for thin low‑thermal‑conductivity materials (specimen size:15×15×3.75 mm); No.2 15 mm general‑purpose probe for most conventional materials (specimen size:30×30×7.5 mm); No.3 30 mm probe for high‑conductivity metals (specimen size:60×60×2 mm). Samples with smooth and adhesive surfaces can be stacked for measurement.
For practical operation, remove prominent particles on sample surfaces to eliminate air gaps. Clamp the probe flatly between two samples and connect USB communication cable. Set testing duration (5‑160 s) and heating power on touch‑screen or supporting software. Power range: 0‑1 W for No.1 probe; 0‑14 W for No.2 and No.3 probes. Keep sample temperature rise below 15 ℃ to prevent thermal drift. After test initiation, imported chips record probe temperature‑time response curves. The ARM processor runs core TPS algorithm to compute thermal conductivity and export editable reports.
Building‑material manufacturers test cement polystyrene boards and mineral‑wool panels. Polymer labs characterize foamed plastics and thin films. New‑material enterprises evaluate alloys, powders, colloids and liquids. With optional external temperature‑control hardware, it achieves wide‑range thermophysical assessment from ‑20 ℃ to 320 ℃. Compared with hours‑long steady‑state testing, batches of specimens can be finished within dozens of minutes to boost laboratory throughput.
A: It supports block solids, powders, granules, pastes, colloids, liquids, coatings and thin films, including metals, ceramics and foamed insulators. Special sample holders are needed for liquid and powder specimens.
A: Precision machining is unnecessary. Solid samples only need relatively flat surfaces. Sample length and width shall be at least twice probe diameter. Smooth sticky samples can be stacked for testing.
A: 7.5 mm probe is for thin low‑conductivity materials. 15 mm is general‑purpose. 30 mm suits high‑conductivity metals. Specimens must meet minimum dimension for corresponding probe.
A: It reaches ±3% accuracy and ≤3% repeatability error under ISO 22007‑2. Test outputs are valid for internal quality control and scientific research reference.
A: Recommended temperature rise is below 15 ℃. Over‑high temperature rise alters material intrinsic thermophysical properties and causes systematic deviation. Lower heating power or shorten testing time for correction.
A: TPS features broad measuring range for solids, powders and liquids. It runs fast with simple sample preparation, reduces contact thermal resistance effect and yields both thermal conductivity and thermal diffusivity.
The BXT‑DR‑S transient plane source thermal conductivity tester leverages mature TPS technology to balance accuracy, testing speed and sample compatibility. It addresses major limitations of conventional thermophysical testing such as long duration and strict sample requirements, and fits quality control and R&D workflows for building‑material, polymer, metal‑material sectors and research laboratories. Compliant with ISO 22007‑2 standard, its multi‑probe setup covers testing from thermal insulators to high‑conductivity metals, while non‑destructive measurement preserves valuable specimens.
If you are sourcing thermal conductivity testing equipment, please contact us for detailed quotations, download the full product catalog or discuss customized testing solutions. We will recommend proper probes and accessories according to your sample conditions and deliver professional selection suggestions.